Our cryogenic dielectric etch technology—Lam Cryo 3.0—delivers enhanced etch rates, vertical high aspect ratio (HAR) profiles, and more. Learn how Lam Cryo 3.0 is optimized to manufacture next-generation 3D NAND devices with 400 layers and beyond from Group VP and GM of Etch Product Group, Harmeet Singh. https://bit.ly/3yCkBVv | Lam Research Corporation
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Our cryogenic dielectric etch technology—Lam Cryo 3.0—delive…
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Lam Research (LRCX) — Semiconductor Equipment Leader Leveraged to Chip Cycles ⸻ Business Snapshot Lam Research is a global leader in wafer fabrication equipment, specializing in etch and… | Siddhaved Raut
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Say hello to the future of conductor etch technology. Akara® builds on decades of innovation, and leverages new proprietary etch solutions to overcome the toughest scaling challenges. Designed for high-volume production, Akara® optimizes wafer output to help chipmakers get more value from their manufacturing equipment. See why leading manufacturers choose Akara® as their production tool for advanced planar DRAM and foundry GAA applications. https://bit.ly/4hZ7Rcu | Lam Research Corporation
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Scaling DRAM demands more than smaller features; it requires new architectures. We provide the process control and material precision to enable 3D stacking, advanced etch profiles, and atomic layer deposition of next-generation materials like molybdenum. Each step moves memory technology beyond its 2D limits and into a new dimensional era. Watch the video for more. | Lam Research Corporation
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You start with a pattern layout. Run the etch process. The result? You get uneven depths — some areas too shallow, others too deep. That’s where design-level solutions come in. With dummy patterning and virtual process modeling, engineers simulate how etchants behave across different layout geometries before ever touching a wafer. Learn more via the blog. https://bit.ly/44btHGe | Lam Research Corporation
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As 3D NAND technology advances, the demand for greater deposition and etch intensity grows. Adding more memory layers requires not only innovative engineering but also precise material deposition and enhanced etch techniques. See how applying stress-compensating materials and leveraging molybdenum for improved conductivity ensure reliable scaling and more in the video below. | Lam Research Corporation
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Explore the etch precision and performance of our most advanced conductor etch technology to date. Akara® eliminates the bottleneck of slow plasma response by leveraging solid-state technology to enable precision, repeatability, and productivity. https://bit.ly/3Xq1Pdb | Lam Research Corporation
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