http://www.coolinnovations.comAs dissipated heat loads continue to rise, engineers seek increasingly efficient heat sinks. The efficiency of various heat sink ...

TODAY'S CUTTING EDGE INTEGRATED CIRCUITS DISSIPATE SUBSTANTIALLY HEAVIER LOADS OF HEAT THAN EVER BEFORE. At the same time, the premium associated with miniaturized applications has never been greater, ...

Available in footprints from 2.0 x 2.0 in. to 5.0 x 5.0 in. and heights from 0.7 to 2.0 in., a line of aluminum heat sinks uses a novel flared pin-fin design that minimizes friction to improve natural ...

Increasing the processing power of electronic equipment often means that more transistors have to be squeezed into tighter packages. And higher circuit densities increase the amount of heat that must ...

In recent years, increases in processing power mean advanced semiconductor devices now dissipate astounding levels of power. For many applications, cooling these devices has become a major challenge.

New zipper fin heat sinks from Advanced Thermal Solutions, Inc. (ATS) are protecting thousands of components from the dangers of excess heat at a lower cost than other high fin density heat sink types ...

A new project at the Frankfurt University of Applied Sciences is researching an AI-based software tool for the more efficient design of finned heat sinks.

Researchers from the Solar Energy Research Institute (SERI) at the Universiti Kebangsaan Malaysia have developed a new passive technology to keep solar panels cool. They claim their new tech can ...

Using PIM for the manufacture of heat sinks instead of extrusion or machining broadens geometry options and creates a dense structure. Figure 1. A plot of thermal conductivity vs. thermal expansion ...